A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair ...
A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned ...
Fast and economical manufacture of high lead/pin count, ultra-fine pitch lead frames. Request Pricing Application Note. Our lead frame manufacturing service ...
The leadframe is a thin metal plate part to be used in semiconductor packages such as IC, LSI, etc. While it supports and fixes an IC chip, its other role ...
Lead frames are manufactured by removing material from a flat plate of copper, copper-alloy, or iron-nickel alloy like alloy 42. Two processes used for this are ...
Lead frames are used in almost all semiconductor packages. Most kinds of integrated circuit packaging are made by placing the silicon chip on a lead frame, then ...